Samsung’s Modem Powers Integrated 5G and Wi-Fi 8 FWA Platform

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Samsung and Broadcom have unveiled the world’s first integrated 5G and Wi-Fi 8 platform for the global fixed wireless access (FWA) market. The solution combines the former’s B1320 5G modem with the latter’s BCM6776 Wi-Fi 8 System-on-Chip (SoC). As of now, global carrier trials and OEM sampling of the platform are underway.

Samsung, Broadcom aim for fiber-level broadband with integrated FWA solution

The integrated 5G and Wi-Fi 8 platform merges 3GPP Release 17 connectivity with the Wi-Fi 8 (IEEE 802.11bn) standard. Samsung’s modem and Broadcom’s SoC aim to offer reliable connectivity and high performance. As such, mobile operators will be able to use the platform to deliver fiber-level broadband services.

The B1320 is a power-efficient 5nm chipset that supports the 3GPP Release 17 standard. It offers downlink speeds of 3.43 Gbps and uplink speeds of 1.17 Gbps with support for LPDDR4x / LPDDR5x. Samsung pairs the modem with a 1.6 GHz quad-core ARM Cortex-A55 CPU.

Furthermore, the B1320 supports a 4Rx/2Tx radio chain, 5 Gbps USXGMII, PCIe Gen 3, and USB 2.0 interfaces. It also features GNSS functionality with support for NR-NTN and NB-NTN satellite communications on the n255 and n256 bands (L- and S-bands).

Now coming to the BCM6776, the SoC features a high-performance quad-core CPU and a dedicated network processing engine. It supports 2×2 Wi-Fi in the 2.4 GHz band and 4×4 Wi-Fi in the 5 GHz and 6 GHz bands. This approach not only simplifies system design but also helps manufacturers lower costs.

Broadcom also includes on-chip 2.4 GHz power amplifiers (PAs) and third-generation digital pre-distortion technology. Moreover, the SoC supports DDR4, LPDDR4, DDR5, and LPDDR5 memory through a versatile memory controller. It also features dual PCIe Gen3 controllers.

“This platform is designed to deliver reliable performance across a wide range of environments, helping operators bring high-quality connectivity experiences to subscribers,” said Joonsuk Kim, Executive Vice President and Head of CP Development at Samsung Electronics.

Leading global OEMs are already integrating the B1320 and BCM6776 platform into their next-gen gateway products. These include companies such as Humax Networks and WNC.

Written by

Binay Konwar

Binay Konwar started his blogging journey in 2014 and has since written plenty of tech articles. At present, he is working as a News Writer at SammyGuru, covering everything about Samsung. He holds a Master's degree in Mathematics, but his real passion lies in tech and writing. In his free time, he enjoys playing chess and watching movies.

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