Samsung and Broadcom have unveiled the world’s first integrated 5G and Wi-Fi 8 platform for the global fixed wireless access (FWA) market. The solution combines the former’s B1320 5G modem with the latter’s BCM6776 Wi-Fi 8 System-on-Chip (SoC). As of...
UPDATE (December 08, 2025): Shortly after we published the report, a Samsung spokesperson reached out to share the following statement: “The information is based on speculation and rumors and is not factual.” It appears Samsung and Broadcom have yet to...
Samsung is desperately trying to gain a foothold in the high-bandwidth memory (HBM) market, and recent developments suggest it’s on the right track. Amidst reports of it closing in on a deal with Nvidia for its HBM3E chips, the company appears to have struck a...
A few months ago, Samsung obtained strong results in Broadcom’s 8-layer HBM3E quality test. It has now reportedly passed the prototype qualification test and completed the pre-mass production evaluation. This means the Korean firm will soon enter Broadcom’s supply...
After falling behind its rivals, SK Hynix and Micron, in the HBM3E market last year, Samsung is finally catching up with the market. While it has yet to pass Nvidia’s qualification test for its 12-layer HBM3E chips, the Korean giant recently passed Broadcom’s...
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