Samsung Helps Apple Make AI Chips with Glass Substrates

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Samsung is attracting a lot of attention for its glass substrate chip technology, which could redefine AI hardware. The company has reportedly supplied samples of its next-generation semiconductor packaging material to Apple. This could allow the Cupertino giant to test the reliability for future AI chip designs.
Samsung’s glass substrates could emerge as a key material in AI chips
According to a report from The Elec, Samsung Electro-Mechanics has been providing glass substrate samples to Apple since last year. These samples replace organic materials used in Flip-Chip Ball Grid Array (FC-BGA) substrates with glass. Industry watcher believes Apple may be planning to design in-house packaging for server AI chips using glass substrates.
Meanwhile, Apple is reportedly collaborating with Broadcom to develop its first server chip for AI processing. Codenamed Baltra, the chip could be manufactured at TSMC. Samsung Electro-Mechanics has also been supplying glass substrate samples to Broadcom. Since Broadcom is a key player in the custom AI chip market, it is a big potential client for Samsung’s glass substrate business.
This Apple and Broadcom collaboration may be another reason why Apple is receiving glass substrate samples. The Cupertino giant may want to assess the packaging material’s performance independently, rather than depending solely on Broadcom’s evaluation.
As of now, Samsung Electro-Mechanics is running a pilot production line for glass substrates at its Sejong plant in South Chungcheong Province. The company aims to kick off mass production after 2027. It also signed a Memorandum of Understanding (MOU) with the Sumitomo Chemical group to establish a joint venture to make glass cores.
“The customer base secured from the existing FC-BGA business can be directly applied to the glass substrate business,” said an industry official. “Since the glass substrate market is still in its early stages with no established standards, the key is to secure customer trust through the quality and specifications desired, rather than focusing on mass production speed.”
















