Computex 2026 | Samsung Shows Off HBM5, Confirms It Uses Heat Path Block (HPB)

At Computex 2026 in Taipei today, Samsung offered a quick look at where AI memory is headed. Samsung showed off a mockup of its next-gen HBM5, a clear sign it’s looking to stay competitive as the AI chip race heats up.

Samsung brings HBM5 to Computex 2026

The highlight of HBM5 is a new thermal design called Heat Path Block, or HPB. As AI systems get more powerful and densely packed, heat has become a serious bottleneck. Samsung’s approach is simple in concept but important in execution.

HPB creates an additional pathway for heat to escape, lowering thermal resistance and helping maintain stable performance under heavy workloads. The company also confirmed plans to use a 2nm base die for HBM5, which should bring noticeable gains in power efficiency and processing capability.

Samsung says it has already tested the technology on its HBM4E, which was also on display. That chip runs at 14Gbps per pin, can scale up to 16Gbps, and delivers bandwidth of up to 4TB/s.

All of this comes as Samsung tries to close the gap with rivals who’ve been leading in AI memory supply. With HBM5, it’s making an early push into the next phase of high-bandwidth memory, and based on what we saw, the company is taking heat management far more seriously than before. If AI demand keeps exploding, that shift may matter more than raw performance alone.

More from Computex 2026: 

• Samsung’s Ultra Slim OLED Panels Could Make Future Laptops Thinner