Rising chip production costs and strong competition are the key reasons
July 2026 Unpacked Mystery Box
Rising chip production costs and strong competition are the key reasons
High-performance on-device AI for smartphones and tablets
Exynos 2700 may instead use a Side-by-Side (SbS) design
3D TIM and HPB offer more efficient heat dissipation
The chip could feature hardware support for path tracing
Exynos 2600 has proven to be a strong performer, particularly on the graphics front
The company aims to increase memory bandwidth by 30% to 40%
The chip uses a deca-core CPU configuration
This could be Samsung’s Redemption Arc for Exynos
Exynos 1680 pairs Xclipse 550 GPU with AMD’s RDNA 3 architecture