Exynos 2700 Could Move Away From FOWLP to Improve Yields

In recent flagship launches, Samsung has been using more Exynos chips. Take the Galaxy Z Flip 7, for example, which comes with the Exynos 2500 chipset globally. More recently, Samsung introduced the Galaxy S26 series. In which the Galaxy S26 and Galaxy S26+ come with the Exynos 2600 chipset in Europe, India, South Korea, and most other global markets.

Galaxy S27’s Exynos 2700 may drop FOWLP packaging

Naturally, there’s an expectation that the Galaxy S27 may follow suit and come with the Exynos 2700 chip in at least these regions. However, a report from Sisa Journal suggests that Samsung is considering dropping a chip packaging technology from the Exynos 2700 to save costs.

More specifically, it may drop fan-out wafer-level packaging (FOWLP) technology for the Exynos 2700. The company first used this technology with the Exynos 2400. The same chipset which powers the Galaxy S24 and Galaxy S24+ in select regions, as well as the Galaxy Z Flip 7 FE and the Galaxy S25 FE.

What is Fan-Out Wafer-Level Packaging (FOWLP)?

Fan-Out Wafer-Level Packaging (FOWLP) is a chip packaging method where components are embedded in a reconstituted wafer and connected using redistribution layers. This allows chips to remain very compact, which is ideal for smartphones. It also helps manage heat better than older methods that rely on printed circuit boards.

As mentioned above, Samsung started using FOWLP with the Exynos 2400, improving heat control by up to 16%. It continued with the Exynos 2600, adding a Heat Pass Block (HPB) to spread heat more efficiently. However, this method is expensive and harder to produce. As a result, Samsung may drop it for future chips like the Exynos 2700.

Exynos 2700 may instead use a Side-by-Side (SbS) design

The same report highlights that Exynos 2700 could use a Side-by-Side (SbS) design. By using this approach, the processor and memory sit next to each other instead of being stacked. This increases the surface area, helping improve heat dissipation and overall efficiency. Samsung is also likely to retain the Heat Pass Block (HPB) to further manage heat.

The main reason for this shift is cost. FOWLP is complex and expensive, with higher risk of defects and lower yields. SbS uses a more conventional design, making production simpler, improving yields, and ultimately reducing manufacturing costs while maintaining solid performance and thermal control.