Exynos 2700 Could Bring Improved Cooling and Bandwidth

Samsung reportedly plans a change for its next-gen flagship mobile chip, the Exynos 2700. The company may move away from its current chip layout in favor of a new side-by-side (SBS) architecture. This could address issues like overheating and slow data transfer.

Samsung could adopt a new design for Exynos 2700

Samsung’s Exynos 2600 brought a substantial improvement in heat management thanks to its Heat Path Block (HPB). The chip used a stacked layout, where the RAM sits on top of the SoC. The company then put the HPB on top of the memory to improve thermal performance. However, this could trap heat between the layers.

According to reports, the upcoming Exynos 2700 could take a different direction to address this limitation. Samsung may adopt a side-by-side (SBS) design, putting the RAM and SoC next to each other. The heat sink will then sit above both components. As a result, the chip could achieve solid heat dissipation.

Furthermore, the SBS layout may improve memory performance. The reason is that the distance between the RAM and the SoC is reduced. The company reportedly aims to increase memory bandwidth by 30% to 40%. If achieved, you can expect even quicker app launches, seamless multitasking, and improved gaming experiences.

Meanwhile, tipster @SPYGO19726 recently shared CPU thermal throttling results for the Exynos 2600 (on the Galaxy S26+) and the Snapdragon 8 Elite Gen 5 (on the Galaxy S26 Ultra). The results suggest that Samsung’s chip offers better thermal stability, meaning it can sustain performance quite well.

Samsung appears to have begun testing the Exynos 2700 through benchmark platforms like Geekbench. The chip could use an in-house second-generation 2nm (SF2P) process with GAA architecture. Some models in the upcoming Galaxy S27 series could use it. The company may begin production in the second half of 2026, though launch may not happen until the end of the year.