Exynos 2700 Could Run Cooler Thanks to a Major Hardware Change

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Samsung’s next flagship chipset may bring more than just faster performance. Over the past years, the company has been steadily doubling down on its Exynos division. Furthermore, it is investing heavily in new architectures, manufacturing processes, and AI capabilities. These efforts are meant to make its in-house chips more competitive with Qualcomm’s Snapdragon and MediaTek’s Dimensity lineup. 

A new report suggests the Exynos 2700, which is expected to debut on some Galaxy S27 series devices next year (most likely S27 and S27 Plus models), could deliver significantly better thermal performance. It could achieve this by adopting a different packaging approach.

Samsung may move away from Package-on-Package (PoP) design

According to ExoticSpice (via Wccftech), Samsung is reportedly considering abandoning its long-used Package-on-Package (PoP) design for the Exynos 2700. In fact, the new packaging approach, known as the Wafer-Level Multi-Chip Module (WMCM), also known as Side-by-Side (SbS) packaging, physically separates the RAM from the application processor (AP). If accurate, this would mark a notable shift in Samsung’s chip design philosophy. Moreover, it could help address one of the biggest challenges facing modern smartphone processors: heat.

Today’s flagship mobile chips typically stack the LPDDR memory directly on top of the processor. This approach saves space inside smartphones and shortens the communication path between the SoC and RAM. However, it also has a downside: both components generate heat in the same area. 

Separating the RAM could improve cooling

Instead of stacking the memory on top of the processor, Samsung is reportedly evaluating a layout where the RAM sits separately on the motherboard. As a result, heat from the processor could dissipate more efficiently. This change could prevent the memory chips from absorbing additional heat generated by the SoC.

In theory, this should lead to several benefits, like lower operating temperatures, better sustained performance, reduced thermal throttling, improved efficiency during long gaming sessions, and better performance during AI workloads and video recording.

While the processor itself may still generate the same amount of heat, distributing components across the motherboard could make it easier for the cooling system to manage temperatures.

Not everything is sunshine and rainbows with this solution

Of course, separating the RAM isn’t a free upgrade. There are trade-offs too. Package-on-Package (PoP) has remained the industry standard for years because it’s extremely space-efficient, an important factor inside increasingly thinner smartphones.

Moving memory away from the processor could increase motherboard complexity and require additional internal space. Consequently, this change might slightly increase signal latency and potentially affect manufacturing costs. Thus, Samsung would need to balance those compromises against any thermal improvements carefully.

Better thermals could mean more consistent performance

The report also claims that Samsung plans to pair the Exynos 2700 with a Heat Pass Block (HPB) positioned above the chipset to further improve heat transfer. On top of that, the HPB would reportedly work together with a larger vapor chamber. This is rumored to debut across various Galaxy S27 models, which are expected to launch in early 2027.

One of the biggest complaints about modern flagship chipsets isn’t peak performance. Instead, it’s how long they can maintain it before reducing clock speeds to control heat. With increasingly powerful CPUs, GPUs, and on-device AI workloads, thermal management has become more important than ever.

If Samsung successfully improves thermal management, the Exynos 2700 could sustain higher performance for longer periods during gaming, video editing, AI background processing, and multitasking. That would likely have a greater impact on the overall user experience.

Written by

David Buliga

David Buliga is a Romanian writer at SammyGuru, where he covers the Samsung and Android ecosystem with a focus on apps, software features, and the trends shaping how we actually use our devices — from Galaxy Watch apps to One UI 9, plus the occasional opinion piece. He joined SammyGuru in 2026 after previously creating entertainment content on YouTube, producing animations and gameplay videos. Currently pursuing a Bachelor's degree in Applied Electronics and Telecommunications, David is passionate about consumer technology and enjoys getting under the hood of smartphones to see what makes them tick. Outside of tech, he loves listening to music, reading books, photography, and exploring the random ideas that often inspire his next story.

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